Shanghai RedEDA Co.,Ltd.

Heavyweight | RedEDA was selected into the 2023 recommended list of industrial software.

In order to implement the Shanghai three-year Action Plan for promoting the High-quality Development of Industrial Software (2021-2023), focus on the pain points and shortcomings in key industries and areas, and enhance the innovation and supply capacity of key software technologies, we will promote the application of domestic industrial software products and the construction of industrial ecology.

The fourth Anniversary of Shanghai RedEDA Co.,Ltd. | Unstoppable and ambitious

Along the way, Shanghai RedEDA Co.,Ltd. adheres to the concept of "making research and development easier", adheres to customer needs, constantly improves core technical capabilities, and provides users with comprehensive chip packaging PCB collaborative design simulation solutions. Focusing on the research and development of EDA tools, we are committed to creating an integrated RedEDA design platform for integrated circuit packaging, schematic logic and system board level.

Focus on EDA software research and development, so that chip packaging technology is no longer "stuck"

In order to get rid of the monopoly of foreign EDA software and the situation that the core technology is controlled by others, Shanghai RedEDA Co.,Ltd. was established in 2020 to lead a team to develop domestic chip packaging and PCB design RedEDA software.

RedEDA invites you to make an appointment with Shanghai SIP China2023

December 13, 2023, the Seventh China system-level Packaging Conference (SiP China 2023) will be held at Hotel Renaissance in Caohejing, Shanghai. From IC design to wafer manufacturing, closed testing extends to terminal applications. Focus on global SiP system-level packaging!

RedEDA was invited to participate in the 9th National Semiconductor Power Devices and Application Technology Symposium

RedEDA was invited to participate in the 9th National Semiconductor Power Devices and Application Technology Symposium and the third Generation Semiconductor Industry Integration and Innovation Development Forum (Guangzhou). Ren Jianhui, vice president of Hongkai Technology, delivered a keynote speech on "RedEDA Electronic Packaging Design solution" in an invited report on November 25. Hongkuai Technology promotes the development of China's power semiconductor industry and provides users with a highly reliable electronic interconnection design platform.

RedEDA invites you to attend the 2023 Industrial Software Ecology Conference!

In order to focus on the "new generation industrial software system" and "new industrial digital transformation paradigm", the Guangdong Provincial Department of Industry and Information Technology, the Guangdong Provincial Department of Science and Technology, the Guangdong Provincial Department of Education and the Shenzhen Municipal people's Government plan to hold the 2023 Industrial Software Ecology Conference in Shenzhen from November 5 to 6, 2023. Guangdong Digitalization Society and the Fifth Institute of Electronics are the host units.

RedEDA was invited to attend the 2023 Industrial Control system Industry Conference

November 3rd,2023, Mark Wang, vice president of Hongkuai Science and Technology, shared the "Security and controllable Scheme of EDA Software for Industrial Control system Circuits"

RedEDA invites you to attend the Annual meeting of China Semiconductor Packaging Technology.

The 21st CSPT will be held on October 25-27 at the Crown International Convention and Exhibition Hotel in Kunshan. At 14:30-14:50 on October 26th,David Wu will deliver a speech on "Chip-package-Circuit Board Collaborative Design". You are cordially invited to participate.

RedEDA was invited to participate in CCF DAC 2023 Forum

From October 13 to October 16, 2023, the 4th Integrated Circuit Design and Automation Conference was sponsored by the Chinese computer Society, sponsored by the CCF Special Committee for Integrated Circuit Design, and co-sponsored by the Institute of Computing Technology of the Chinese Academy of Sciences and Tsinghua University.

RedEDA won the honorary certificate of "creating in Shanghai" in 2023 and was successfully shortlisted in the 12th China Innovation and Entrepreneurship Competition.

On August 17, 2023, the Shanghai Municipal Commission of Economy and Information Technology announced the list of specialized and special new smes in Shanghai in 2023 (the second batch). RedEDA was awarded "Shanghai Specialized and special new Small and medium Enterprises". This honor is not only a high affirmation of the company's core business, but also a recognition of its professional ability and operational quality.

RedEDA won the title of "specialized and special new" enterprise

On August 17, 2023, the Shanghai Municipal Commission of Economy and Information Technology announced the list of specialized and special new smes in Shanghai in 2023 (the second batch). Shanghai RedEDA Co., Ltd. was awarded "Shanghai Specialized and special new Small and medium Enterprises". This honor is not only a high affirmation of the company's core business, but also a recognition of its professional ability and operational quality.

RedEDA V2.0 is officially released and begins large-scale commercialization!

Under the guidance of the predecessors of the EDA industry and driven by customers in the electronics industry in many fields, the RedEDA product research and development process please climb to another high-rise.The products have been more deeply polished and verified. With the unremitting efforts of the past two years, RedEDA officially released a more powerful V2.0 version on July 1, 2023.

RedEDA joins hands with Kylinsoft to help domestic enterprises get rid of their dependence on foreign electronic development platforms

The successful adaptation of the domestic EDA software RedEDA V1 with the Kylinsoft V10 operating system has achieved a technological breakthrough in the localization of the electronic research and development platform, marking the end of the era when the domestic electronic product research and development platform completely relies on foreign technology.

The schematic design software RedSCH V1 was released

On May 31, 2022, the domestic circuit schematic design software RedSCH V1 version was released, and the RedEDA design software completed the two design processes of "schematic diagram - PCB" and "schematic diagram - Package". Since then, the RedEDA software platform has no circuit design shortcomings.

RedPCB video tutorial officially launched Huawei cloud, digital industrial software Alliance production-education integration cloud platform

RedPCB as a domestic high-end PCB design tool, based on Huawei Cloud, digital Industrial software Alliance industrial software production and education integration cloud platform launched RedPCB video tutorial. Actively respond to the "wisdom" to inspire talents, "education" to see the future ", cultivate digital talents, and promote talents in the field of digital economy.

Domestic PCB/Package design software --RedEDA software function display

Overcome the barriers of PCB/Package design technology, and officially released the PCB design tool -RedPCB on October 1, 2021. On February 1, 2022, the Package design tool -RedPKG was released, and the domestic PCB/Package software entered the track.

The first chip package design tool in China --RedPKG V1 release

RedPKG is a fully domestic packaging design tool, whether from financial support, or technical code, fully developed by the Chinese people, completely independent property rights. Based on the needs of domestic semiconductor design companies and sealed test plants, combined with the use habits of domestic industry engineers, Design accuracy can be down to the nanoscale, and EDA design tools are supported across operating system platforms. Current support includes Wire Bonding process package design, Flip Chip process package design, and multi-chip package design technology.

RedEDA, a domestic high-end PCB design tool, was released

RedEDA is a domestic funded, fully developed, independent property rights EDA tool. Development needs are based on domestic including computers, Communication, industrial control, automotive, military, consumer electronics and other fields of large customer needs, design accuracy can support to the nanometer level, It also supports EDA tools across operating system platforms.